Thursday, April 26, 2012

Intel's 3D Transistor: Why It Matters


Intel's 3D transistors are no small feat. Some are calling it a breakthrough that will allow Intel to continue to make chips that adhere to Moore's Law (i.e. the number of transistors that can be placed on a circuit will double every two years).
Even that impressive feat is just business as usual. After all, Moore's Law has been in effect for decades. The bigger news would be if Moore's Law no longer applied to Intel chips.
So what's the big deal with Intel's 3D transistors? The answer lies in more than just smartphones, tablets, and set-top boxes. This fundamental new way of making the circuits of microchips could have a dramatic impact on everything from the smallest handheld devices to the biggest datacenters.

The Future of Computing

There's no denying that the future of computing lies in small, low-power solutions coupled with big-iron cloud services. Smartphones are becoming personal computers, powerful enough to run simple desktop computing environments. Tablets are cannibalizing laptops. Entire home entertainment experiences are being jammed into tiny set-top boxes and embedded into televisions. Even Microsoft's next version of Windows will run on low-power ARM-based chips.
Intel hasn't excelled in all of these areas. It has a presence in televisions, thanks to Google TV and the Boxee Box, but so far the company hasn't gained much traction in smartphones and tablets. Intel's Moorestown chips are largely ignored. Its Medfield chips aren't due to appear in any products until later this year, and they still may not fare well against the more-established ARM processors.
With 3D transistors, Intel may finally have the ammunition it needs to do battle in the smartphone and tablet markets. Intel claims its new transistors can switch 37 percent faster than those made with its existing 32-nm process in chips that operate at low voltage, or 18% faster in chips that operate at high voltage. Transistors switching at the same speed as those in the company's 32nm chips can operate at significantly lower voltage, cutting power consumption in half. This change in how chips are produced is expected to raise production costs by a modest 2 or 3%, which is well worth the dramatic improvement in performance.

What It Means for You

 The first products to hit the market using this new manufacturing technique will be Intel's "Ivy Bridge" line, the successor line to the current "Sandy Bridge" line. This means the new technology will first appear in laptops, desktops, and servers that use Intel's chips. The faster switching speeds, lower voltage operation, and lower leakage should make Ivy Bridge processors considerably more energy-efficient than the Sandy Bridge CPUs in systems today. These products are expected to hit the market in early 2012.

Intel will use this 3D transistor structure on all chips produced on its 22nm manufacturing process, regardless of the type of chip or to which market it is targeted. The upsides should be considerable and the downsides minimal. Other chip fabrication companies have been working on 3D gate structures, but aren't expected to bring them to market for some time. Most of Intel's competitors aren't expected to ship 22nm high-performance products until at least late 2012, and won't use a 3D gate structure similar to Intel's until the next major manufacturing process step, a couple of years later.

Ref:
PCW

Raspberry Pi The Computer of 25$



The Raspberry Pi is a credit-card sized computer that plugs into your TV and a keyboard. It’s a capable little PC which can be used for many of the things that your desktop PC does, like spreadsheets, word-processing and games. It also plays high-definition video. We want to see it being used by kids all over the world to learn programming.  The full specifications for Raspberry Pi include an ARM1176JZF-S 700 MHz CPU, and 256 megabytes of RAM,  1080p30 h.264/MPEG-4 AVC high-profile decoder GPU, Composite RCA (PAL & NTSC), HDMI (rev 1.3 & 1.4)[54], raw LCD Panels via DSI[55][56] 14 HDMI resolutions from 640×350 to 1920×1200 plus various PAL and NTSC standards video output, HDMI audio,SD/MMC/SDIO card slot for on board storage, 10/100 Ethernet for network interface ,8 × GPIO, UART, I²C bus, SPI bus with two chip selects, +3.3 V, +5 V, ground, weight 45 gr,support operating system for Rspberry Pi Debian GNU/Linux, Fedora, Arch Linux[2], RISC OS. 

The Raspberry Pi will use Linux kernel-based operating systems. Debian GNU/Linux, Iceweasel, Calligra Suite and Python are planned to be bundled with the Raspberry Pi.[5]
The GPU hardware is accessed via a firmware image which is loaded into the GPU at boot time from the SD-card. The firmware image is known as the binary blob. While the associated Linux drivers are closed source.[72] Application software use calls to closed source run-time libraries which in turn calls an open source driver inside the Linux kernel. The API of the kernel driver is specific for these closed libraries. Video applications use OpenMAX, 3D applications use OpenGL ES and 2D applications use OpenVG which both in turn use EGL. OpenMAX and EGL use the open source kernel driver in turn.

Ref:

www.raspberrypi.org
http://spectrum.ieee.org/podcast/geek-life/hands-on/arduinos-playmate




Wednesday, April 25, 2012

Google Drive- Cloud from Google

 Google drive is a place where you can create, share, collaborate, and keep all of your stuff. Whether you’re working with a friend on a joint research project, planning a wedding with your fiancé or tracking a budget with roommates, you can do it in Drive. You can upload and access all of your files, including videos, photos, Google Docs, PDFs and beyond. 
With Google Drive, you can:

  • Create and collaborate. Google Docs is built right into Google Drive, so you can work with others in real time on documents, spreadsheets and presentations. Once you choose to share content with others, you can add and reply to comments on anything (PDF, image, video file, etc.) and receive notifications when other people comment on shared items.
  • Store everything safely and access it anywhere (especially while on the go). All your stuff is just... there. You can access your stuff from anywhere—on the web, in your home, at the office, while running errands and from all of your devices. You can install Drive on your Mac or PC and can download the Drive app to your Android phone or tablet. We’re also working hard on a Drive app for your iOS devices. And regardless of platform, blind users can access Drive with a screen reader.
  • Search everything. Search by keyword and filter by file type, owner and more. Drive can even recognize text in scanned documents using Optical Character Recognition (OCR) technology. Let’s say you upload a scanned image of an old newspaper clipping. You can search for a word from the text of the actual article. We also use image recognition so that if you drag and drop photos from your Grand Canyon trip into Drive, you can later search for [grand canyon] and photos of its gorges should pop up. This technology is still in its early stages, and we expect it to get better over time.
Drive is built to work seamlessly with your overall Google experience. You can attach photos from Drive to posts in Google+, and soon you’ll be able to attach stuff from Drive directly to emails in Gmail. Drive is also an open platform, so we’re working with many third-party developers so you can do things like send faxes, edit videos and create website mockups directly from Drive. To install these apps, visit the Chrome Web Store—and look out for even more useful apps in the future.

Reference: http:
//googleblog.blogspot.com/2012/04/introducing-google-drive-yes-really.html

 

Εξαιρετικά λεπτό το νέο iPhone, λένε τώρα οι φήμες

Το πάχος και το βάρος του επόμενου iPhone αφορούν οι νεότερες πληροφορίες που προέρχονται από την Ιαπωνία. Λέγεται πως η Apple έχει βρει τον τρόπο με τον οποίο θα μειώσει το πάχος του κάτω από τα 8 χιλιοστά από 9,3 χιλιοστά στο iPhone 4S σήμερα. Αν και η μείωση αυτή μοιάζει μικρή, μπορεί να σημάνει την μείωση του κόστους παραγωγής έως και 20%. Η ανεπιβεβαίωτη πληροφορία προέκυψε μετά τις φήμες ότι η οθόνη στο επόμενο iPhone θα έχει το λεγόμενο in-cell touch panel από Ιάπωνες κατασκευαστές. Χάρη στην τεχνολογία αυτή, η Apple θα μπορέσει να αφαιρέσει ένα επίπεδο από την οθόνη, και συγκεκριμένα αυτό με τους αισθητήρες αφής και ένα ακόμα (για την επικόλληση στην οθόνη). Επιπλέον, λέγεται ότι η Apple θα χρησιμοποιήσει νέα, πιο λεπτή μπαταρία και το πίσω κάλυμμα της συσκευής θα είναι μεταλλικό. Ιάπωνας αναλυτής της KGI Securities εξέδωσε σχετική έκθεση αποδεχόμενος όλες αυτές τις πληροφορίες, αν και ανεπιβεβαίωτες. Ο Ming-Chi Kuo καταλήγει στο συμπέρασμα ότι το επόμενο iPhone θα μπορούσε να έχει πάχος 7,09 χιλιοστά όταν το iPhone 4S θα έχει πάχος 9,3 χιλιοστά, μεταδίδει το AppleInsider. Πάντως, ο ίδιος αναλυτής καταλήγει στο συμπέρασμα ότι η στροφή στα in-cell panel μπορεί να μειώσει το κόστος διαχείρισης της γραμμής παραγωγής και να αυξήσει την παραγωγή, με αποτέλεσμα το κόστος της να μειωθεί από 10% έως και 20%. Το νέο iPhone φημολογείται ότι θα κυκλοφορήσει το τρίτο τρίμηνο του 2012, εάν η Apple ακολουθήσει το χρονοδιάγραμμα πριν την κυκλοφορία του iPhone 4S (το οποίο διατέθηκε Οκτώβριο, αντί Ιούνιο όπως συνέβη με τα προηγούμενα μοντέλα iPhone). In.gr Τεχνολογία

Sunday, November 28, 2010

AMD & INTEL μαζι για την δημιουργια mobile device OS

AMD has thrown in with Intel and Nokia, announcing support for MeeGo this morning. According to the press release, AMD will “provide engineering resources” to MeeGo development, with a mind to using the open-source OS in its embedded device plans “and create expanded market opportunities for our forthcoming Accelerated Processing Units.”
The news was announced by Chris Schlaeger, Director of AMD Operating System, at the MeeGo Conference 2010 this morning. Schlaeger claims to have been tinkering with a Nokia N810 from the Maemo days, and is confident about MeeGo’s potential in APU computing:
“We will put resources, invest time and money where we think we can put meaningful contributions. If you think GPU/CPU can’t make a difference, beware.” Chris Schlaeger, Director of AMD Operating System
AMD is already involved with The Linux Foundation, the organization hosting MeeGo, where it is a gold level member.
AMD Joins MeeGo Linux Open Source Project for Next-Generation Mobile, Embedded Platforms
AMD to Contribute Engineering Resources to Help Drive Linux-Based Open Source Operating System
DUBLIN, IRELAND, Nov 15, 2010 — At the MeeGo Conference 2010, AMD (AMD 7.63, 0.00, 0.00%) today announced it has joined The Linux Foundation’s MeeGo open source Linux project, and will provide engineering expertise intended to help establish the technical foundations for next-generation mobile platforms and embedded devices.
“MeeGo represents an exciting, open-source mobile operating system we expect to be adopted by mobile and embedded device makers over time,” said Ben Bar-Haim, corporate vice president, software development, AMD. “We are glad to provide engineering resources to joint industry efforts like MeeGo and expect that this operating system will help drive our embedded plans and create expanded market opportunities for our forthcoming Accelerated Processing Units.”
“Built from the ground up for a whole new class of mobile computing devices, MeeGo gives companies like AMD and its partners unlimited opportunities to accelerate innovation for the next generation of computing,” said Jim Zemlin, executive director at The Linux Foundation. “As an existing Linux Foundation member, AMD will be an important and valuable contributor to the MeeGo Project.”
The MeeGo Linux-based open-source operating system is primarily designed for mobile hardware platforms such as ultra-mobile notebooks, tablets, embedded in-vehicle infotainment systems and smart phones.
The MeeGo project is hosted by The Linux Foundation, a non-profit consortium dedicated to fostering the growth of Linux. AMD is currently a gold level member of the Linux Foundation and has a seat on The Linux Foundation’s board of directors.
About AMD Advanced Micro Devices (AMD 7.63, 0.00, 0.00%) is an innovative technology company dedicated to collaborating with customers and technology partners to ignite the next generation of computing and graphics solutions at work, home and play. For more information, visit http://www.amd.com.
About MeeGo MeeGo is an open source, Linux project which brings together the Moblin project and Maemo into a single open source activity. MeeGo integrates the experience and skills of two significant development ecosystems, versed in communications and computing technologies. The MeeGo project believes these two pillars form the technical foundations for next generation platforms and usages in the mobile and device platforms space. For more information, visit http://meego.com.
Advanced Micro Devices, Inc. AMD, the AMD Arrow logo, and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.

http://www.slashgear.com/amd-join-meego-project-with-intel-nokia-will-use-it-with-apus-15114106/
Pampos Simeou

Saturday, November 27, 2010

Επεξεργαστές με 1000 πυρήνες από την Intel

Ένα πειραματικό chip της Intel αποδεικνύει πως είναι εφικτή η δημιουργία επεξεργαστών που θα διαθέτουν μέχρι και 1000 πυρήνες.
Αν και κάτι τέτοιο αρχικά απευθύνεται κυρίως σε μεγάλες εταιρείες και επαγγελματίες, αφού οι απλοί καταναλωτές μόλις άρχισαν να «γεύονται» τις… χάρες των πολυπύρηνων υπολογιστών, ένα chip της Intel, ο 48πύρηνος Shingle Chip Cloud Computer (SCC) θεωρητικά μπορεί να φτάσει μέχρι και τους 1000 πυρήνες. Η αρχιτεκτονική του είναι τέτοια που οι δημιουργοί του μπορούν να προσθέτουν και να προσθέτουν πυρήνες, μέχρι να περάσουν το όριο των 1000 πυρήνων, οπότε και τα αποτελέσματα αρχίζουν να αντιστρέφονται – και η προσθήκη περισσότερων να έχει αρνητικά αποτελέσματα.
Ένας τέτοιος πολύ-επεξεργαστής, βέβαια, δεν έχει και τόσο νόημα όσον αφορά στους απλούς χρήστες, τους desktop υπολογιστές, τα laptops, netbooks και, γενικά, την «καταναλωτική» τεχνολογία, όχι μόνο λόγω του ότι θα συνοδευόταν από άκρως απαγορευτικό κόστος, αλλά και διότι για να είναι εκμεταλλεύσιμοι περισσότεροι από έναν πυρήνες, πρέπει να είναι «γραμμένες» έτσι και οι εφαρμογές ώστε να τους εκμεταλλεύονται – και όσο αυξάνεται η πολυπλοκότητα ενός επεξεργαστή, αντίστοιχα αυξάνεται και αυτή του λογισμικού του. Μάλλον, λοιπόν, δεν θα δούμε (και δεν χρειάζεται να δούμε)… 1000πύρηνους επεξεργαστές στα PCs μας στο κοντινό μέλλον. Αυτό, όμως, δεν σημαίνει πως δεν θα ευνοήσει και εμάς τους… κοινούς θνητούς!
Το πιθανότερο είναι πως οι τεχνολογίες που ενσωματώνονται στο συγκεκριμένο chip θα «κυλήσουν» σιγά-σιγά προς τους «καταναλωτικούς» επεξεργαστές, οδηγώντας σε ακόμη μεγαλύτερη αύξηση επιδόσεων και μείωση κατανάλωσης. Για παράδειγμα, το SCC επιτρέπει στους προγραμματιστές όχι μόνο να ορίζουν «σε πόσους πυρήνες θα τρέχει η εφαρμογή τους», αλλά και να έχουν έλεγχο της συχνότητας και κατανάλωσης τους – κάτι που σίγουρα θα μπορούσε να εκμεταλλευτεί μια μελλοντική έκδοση των Windows για ακόμη καλύτερο power management, αλλά και «throttling» των διεργασιών της (διαχείριση των πόρων/κατανάλωσης κάθε εφαρμογής βάσει της προτεραιότητας της).

PCW

Monday, August 9, 2010

Hynix rolls out 64Gb NAND flash chips

KOREAN MEMORY MAKER Hynix announced it has begun mass production of 64Gb NAND flash chips.
The 64Gb NAND chips are built on 20nm class technology at the company's 300mm fab in Korea. The company has been working on getting parts rolling off the factory floor since developing the technology back in February. Now it's ready to take on its rivals like Samsung with the mass produced 64Gb chips.
The 64Gb chip doubles the density of current NAND flash and Hynix claims it provides a 60 per cent increase in productivity compared to the company's current 30nm class technology.
Hynix reckons the 64Gb NAND flash chips will be integrated into advanced mobile products like smart phones, mobile Internet connected devices and tablets.
The company said it is also working with Israeli-based NAND company Anobit, which is using its controller devices in Hynix's 30nm class 32Gb flash chips. The 20nm class NAND flash chips and controller devices are due to be validated in September.
"Hynix decided to mass produce the industry's highest density 64Gb chips using 20nm class technology in order to fully satisfy demand from the customers," said Dr S W Park, EVP and CTO of Hynix.
"With these 20nm class 64Gb chips, the company is enabled to provide customized, high performance products in a timely manner which perfectly suits mobile solutions including smartphones, tablet PCs and others."

www.theinquirer.com
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